- KoMarvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Acceleratorsrea Risks Losing Ground in Global Data Center Market Amid Regulatory Challenges (2025/01/06 Chiplet marketplace)
- 輝達 AI 晶片的 CoWoS 需求居功厥偉 (2025/01/06 TechNews)
- NVIDIA, TSMC Develop Advanced Silicon Photonic Chip Prototype, Says Report (2025/01/06 wccftech)
- Penn State makes breakthrough in photonic switching (2025/01/07 CompoundSemiconductor)
- 超越摩爾定律！中國國產矽光子晶片重大突破，輝達和台積電聯手押注！(2025/01/07 鉅亨網)
- High-Power Tunable Laser on Silicon Photonics for Space Exploration (2025/01/07 AZOoptics)
- 輝達聯手台積電 矽光子晶片原型研發邁出重要一步 (2025/01/09 科技島)
- Imec announces a breakthrough in silicon photonics (2025/01/09 NEWelectronics)
- Imec Pioneers Full Wafer-Scale Production of GaAs-Based Nano-Ridge Lasers on 300mm Silicon Wafers (2025/01/09 embedded)
- Next Up for Custom AI Accelerators: Co-Packaged Optics (2025/01/15 Marvell)
- IBM Introduces Co-Packaged Optics, an Optical Link Packaging Scheme (2025/01/15 All About Circuits)
- Optical transceivers can beat the heat in the era of high-speed data centers (2025/01/16 Laser Focus World)
- Under Pressure from Overheating Issues, NVIDIA Rumored to Launch CPO Switch in March (2025/01/16 TrendForce)
- GlobalFoundries to create new silicon photonics facility (2025/01/22 Optics)
- TSMC prioritizes COUPE tech, eyes silicon photonics lead (2025/01/23 DIGITIMES)
