2025-11-11 – Silicon Photonics Industry Networking & Knowledge-Sharing Session
With the rapid growth of high-performance computing, AI servers, and sensing applications, silicon photonics is accelerating toward mass production and real-world deployment. To promote cross-domain collaboration and technical exchange, the HiSPA International Alliance for Heterogeneous Integration in Silicon Photonics is hosting the “Silicon Photonics Industry Exchange Seminar,” bringing together domestic and international partners from industry, academia, and research to focus on manufacturing processes, testing, applications, and international collaboration. The program also features networking and interactive sessions with Japanese companies such as Resonac and Yamaha Intelligent Machinery, strengthening global connections and creating opportunities for industry partnerships.
The seminar was held on November 11, 2025, at IB202 Conference Room (2F), International Building, National Taiwan University of Science and Technology (NTUST). The agenda includes introductions of new member organizations, as well as topics ranging from silicon photonics R&D progress, advanced electronic–photonic packaging, PIC wafer-level testing, silicon photonics simulation software and foundry ecosystem integration, to high-speed optical interconnects (Transceivers, CPO, Micro LED) and trend insights on OCP/PECC. Speakers will include representatives from Foxconn Research Institute, Resonac, Oasys Technology, Enlitech, Lightwave Technology, and Suruga Seiki, offering participants a valuable platform to grasp the latest technology trends, supply-chain collaboration opportunities, and pathways to practical implementation.
