The Heterogeneous Integration Silicon Photonics Chip R&D Center (HiSiPIC) at National Taiwan University of Science and Technology (NTUST) and the Taiwan Photonics Society co-hosted the OPTIC 2025 Silicon Photonics Workshop. The workshop brought together Japanese experts and Taiwan’s industry, academia, and research communities, focusing on key topics including silicon photonics platforms, photonic packaging, wafer- and device-level testing, high-speed modulators, WDM photonic architectures, and high-power lasers.
This workshop highlighted the latest technological progress and industrial implementation issues in Silicon Photonics and Co-Packaged Optics (CPO). Topics ranged from platform development and packaging strategies to wafer and device testing methodologies, high-speed modulators, scalable WDM technologies for data centers and accelerated computing, and critical building blocks such as high-power DFB lasers for silicon photonics and advanced packaging processes including TGV fabrication. Speakers represented a broad cross-section of the ecosystem, including TSRI, ASE, MPI, National Tsing Hua University, National Sun Yat-sen University, NTUST, the University of Tokyo, and WIN Semiconductors, offering participants a comprehensive view of the trends and challenges shaping the Silicon Photonics and CPO ecosystem.
